DIES Products & Process

Product & Process

Poly-crystal Diamond

Advantages

The advantages of Polycrystalline diamond dies.

  • Excellent abrasion resistance High abrasion resistance gives dies a long life and reduces the replacement cycle.
  • Low breakage rate Fewer breakages than natural diamond (ND) allow for stable use.
  • Flexible grain selection Diamond grain size can be selected in various ways to match the wire characteristics.
  • Wide wire drawing range Wire drawing is possible across a wide range of diameters from 0.07mm to 32mm.

Applications

The application fields of Polycrystalline diamond dies.

  • Saw wire

    Saw wire

    Saw wire for silicon & solar cutting

  • Stainless wire

    Stainless wire

    Stainless steel wire drawing

  • Welding wire

    Welding wire

    Welding wire drawing

  • Tire cord

    Tire cord

    Steel cord for tire reinforcement

  • Brass-plater wire

    Brass-plater wire

    Brass-plated wire (bead wire, etc.)

  • Electrical wire

    Electrical wire

    Electrical & electronic wire drawing

  • Copper / Pipe / Cable wire

    Copper / Pipe / Cable wire

    Wire for copper, pipe & cable

Manufacturing process

The manufacturing process of Polycrystalline Diamond Dies.

SANDVIK Compax Diamond Die Blanks 포장
Compax PCD blank
SumiDIA PCD 블랭크 트레이
Sumidia PCD blank
STEP 01

PCD Raw Material

GE Superabrasives

  • 5010/D-6, 5015/D-12, 5025/D-15, 5035/D-18 series

SUMITOMO

  • WD805/D-6, WD810/D-12, WD815/D-15, WD820/D-18 series,
    WD910/D-12, WD915/D-15, WD920/D-18, WD925/D-21 series
Sintering Process photo
STEP 02

Sintering Process

  • Special sintering process (toughness, rigidity, durability)
  • Extended dies life
  • Temperature of sintering powder, precise pressure, time (shock absorption, thermal conductivity)
Precision Machining Process photo
STEP 03

Precision Machining Process

  • Centering / Leveling
  • Roughing, finishing, taper work
  • CASE work
Forming LASER Drilling Process photo
STEP 04

Forming LASER Drilling Process

  • In-house development of 273 DATE Programs
  • Forming and drilling of Mouth, Approach, Reduction, Back
  • Ultra-precision work maintained under constant temperature and humidity

Controlled Area

Mouth Enlargement Process photo
STEP 05

Mouth Enlargement Process

  • Automatic machine
  • First process of finished product
  • Machining of the wire inlet (Mouth) (50~80°)
  • Back, Exit (50°~80°) machining
1st Enlargement Process photo
STEP 06

1st Enlargement Process

  • Automatic machine, manual polishing machine
  • 1st size roughing
  • Approach (20 ± 50°), Reduction (10 ~ 30°)
2nd Enlargement Process photo
STEP 07

2nd Enlargement Process

  • Automatic machine
  • Size medium-roughing
  • Approach, Reduction work
Machining Finish Process photo
STEP 08

Machining Finish Process

  • Automatic machine
  • Finishing of the 1st and 2nd enlargement processes
  • Approach(20±50°), Reduction(10~30°), Back(0.1d or more) machining finish
Polishing (Bearing) Process photo
STEP 09

Polishing (Bearing) Process

  • Bearing work (10~60°)
  • Final wire-diameter work (precision 5/10,000mm)
Ultrasonic Polishing Process photo
STEP 10

Ultrasonic Polishing Process

  • Precision and gloss polishing of the bore surface
  • Ultrasonic polisher, automatic-angle pin change
Visual Inspection / Cleaning Process photo
STEP 11

Visual Inspection / Cleaning Process

  • Visual inspection: roundness, surface condition, bubbles, ring, reduction curvature
  • Ultrasonic cleaning: removal of foreign matter
Quality Inspection Process photo
STEP 12

Quality Inspection Process

  • Size inspection: Conoptica full inspection (5/10,000mm)
  • Geometry: Conoptica sampling inspection (5%)
View Quality Inspection Details
PCD Dies Finished Product photo
STEP 13

PCD Dies Finished Product

  • Poly-Crystalline Dies