DIES Info

DIES Info

Raw Material

The quality of a die begins with its raw material. D&S DIES carefully selects only verified premium raw material from world-leading diamond suppliers such as SANDVIK HYPERION(G.E) and SUMITOMO, and manufactures precision dies from high-quality polycrystalline diamond (PCD) optimized for the Wire Drawing industry.

Raw Material

Carefully Selected Diamond Raw Material

The polycrystalline diamond (PCD) raw material used by D&S DIES is based on an ultra-fine grain structure, delivering outstanding wear resistance and a high-quality surface finish. Grain size and support structure can be selected across a wide range to match the characteristics of the wire, responding to diverse drawing processes.

  • Ultra-Fine Grain Structure

    A polycrystalline diamond (PCD) made of submicron (Sub-µm) ultra-fine grains, with a uniform and dense microstructure.

  • Excellent abrasion resistance

    Its excellent abrasion resistance gives the die a long service life, enabling stable and continuous drawing operations.

  • High-Quality Surface Finish

    It delivers a high-quality surface finish, making it suitable for precision wire drawing and fine finishing work.

  • Diverse Grain Size · Support Structure

    A wide range of grain sizes from Sub-µm to 50µm and support structures such as Self-Supported · Tungsten Carbide-Supported can be selected.

Suppliers

Raw Material Specifications by Supplier

Dimensions and supply specifications for the raw materials of SANDVIK HYPERION(G.E) and SUMITOMO. Select a supplier tab to view the detailed specification table and Shape drawings.

Compax® - Dimensions & Availability Chart

Self-Supported Die Blanks

Compax Self-Supported Die Blanks — Dimensions & Availability
ADDMA Nominal Diamond
Diameter x Thickness
Grain size Product Dimension[mm]
Sub µm 5µm 25 µm Tool Blank
Diameter
Recommended
Bore Size(mm)
D63.1 x 1.05010-MFU5010-TSU5010-MF5010-TS5010-MFC5010-TSC0.5
D123.1 x 1.55015-MFU5015-TSU5015-MF5015-TS5015-MFC5015-TSC1.0
D155.2 x 2.55025-MF5025-TS5025-MFC5025-TSC1.5
D185.2 x 3.65035-MF5035-TS5035-MFC5035-TSC2.0

● = MF(metal filled)    ○ = TS(thermally stable)

Sub-micron die blanks belong to our Compax® die blanks family of products and one of many premium products available for the wire industry.

Sub-micron die blanks are polycrystalline (PCD) product with an ultra-fine grain microstructure.

The unique material properties provide very good abrasion resistance and the ability to achieve a high quality surface finish.

Tatget applications

  • brass-plated wire
  • electrical wire
  • fine finishing applications
  • glass scribing
  • sawing wire
  • stainless steel
  • tire cord
  • welding wire

Tungsten Carbide-Supported Die Blanks

Compax Tungsten Carbide-Supported Die Blanks — Dimensions & Availability
ADDMA Nominal Diamond
Diameter x Thickness
Grain size Product Dimension[mm]
3 µm 5 µm 12 µm 25 µm 50 µm Tool Blank
Diameter
Recommended
Bore Size(mm)
D121.5 x 1.552353.99±0.0130.8
D154.0 x 2.358235123522354308.12±0.0131.8
D184.0 x 2.958295129522954358.12±0.0132.3
D217.0 x 4.058405240553013.65±0.0133.5
D247.0 x 5.358535253553513.65±0.0134.6
13.0 x 7.05225572524.13±0.0255.2
D2713.0 x 8.751085208573024.13±0.0255.8
D3013.0 x 11.651115211573524.13±0.0257.6
18.6 x13.5591334.00±0.02511.6
D3318.6 x 15.5591534.00±0.02512.0
18.6 x 17.5591712.5
D3618.6 x 18.5591834.00±0.02512.7

* Maximum recommended bore size for non-ferrous wire. Hard-ferrous wire die size normaly should not exceed 65% of this diameter.

Zero/No-Support Dies material

SUMITOMO Zero/No-Support Dies material
ADDMA No. Product No. Dimensions(mm) Concentricity
(mm)
Maximum hole
size(mm)
Available grain size
dDT 1351225
* SELF-SUPPORTED DIE BLANKS
D6WD7052.5±0.1-1.0+0.2-0.0-0.5F-M(C)E
D12WD7103.2±0.1-1.5+0.2-0.0-1.0F-M(C)E
D15WD7155.2±0.1-2.5+0.2-0.0-1.5F-M(C)E
D18WD7205.2±0.1-3.5+0.2-0.0-2.0F-M(C)E
* SELF-SUPPORTED DIE BLANKS(THERMALLY STABLE)
D6WD8052.5±0.1-1.0+0.2-0.0-0.5F-M(C)E
D12WD8103.2±0.1-1.5+0.2-0.0-1.0F-M(C)E
D15WD8155.2±0.1-2.5+0.2-0.0-1.5F-M(C)E
D18WD8205.2±0.1-3.5+0.2-0.0-2.0F-M(C)E
* TUNGSTEN CARBIDE SUPPORTED DIE BLANKS
D12WD9101.5 +0.4-0.04.00+0.00-0.101.5+0.2-0.10.201.8FSM(C)E
D15WD9154.0±0.48.12±0.052.3+0.2-0.10.251.8FSM(C)E
D18WD9204.0±0.48.12±0.052.9+0.2-0.10.252.3FSM(C)E
D21WD9257.0 +0.8-0.113.35±0.054.0+0.2-0.10.353.5-SMCE
D24WD9307.0 +0.8-0.113.35±0.055.3+0.2-0.10.404.6-SMCE
D27WD9409.0 +0.8-0.314.50±0.057.5+0.2-0.10.405.4--MCE
WD94513.0+1.0-0.324.13±0.019.0+0.5-0.00.335.8--MCE
D30WD95013.0+1.0-0.324.13±0.0512.0+0.5-0.00.337.6--MCE
D33WD96013.0+1.0-0.324.13±0.0116.0+0.5-0.00.3310.5---CE
D36WD97019.0+1.0-0.035.00±0.0119.0+1.0-0.00.6012.7---E
WD97525.042.0020.00.6015.7---E
WD98030.0+2.0-0.047.13±0.0122.0+1.0-0.00.6019.0---E
WD99040.067.0025.00.7525.7---E
WD99545.067.0027.00.7529.0---E

Shape

  • Circular plan view and rectangular cross-section drawing

    WD910~950 / 970~995

  • Trapezoidal cross-section drawing

    WD960 / WD970

  • Trapezoidal cross-section drawing

    WD910 ~ 920MW

  • Rectangular cross-section drawing