DIES 信息

DIES Info

原石信息

拉丝模的品质始于原石。D&S DIES 严格甄选并使用来自 SANDVIK HYPERION(G.E)SUMITOMO 等世界一流金刚石原石供应商的经检验的优质原石,采用为拉丝(Wire Drawing)行业优化的高品质多晶金刚石(PCD)制作精密拉丝模。

Raw Material

严选金刚石原石

D&S DIES 所使用的多晶金刚石(PCD)原石以超细颗粒结构为基础,实现出色的耐磨性与高品质的表面光洁度。可依据 Wire 的特性在宽范围内选择粒度(Grain size)与支撑结构,满足多样的拉丝工艺需求。

  • 超细颗粒结构

    由亚微米(Sub-µm)级超细颗粒构成的多晶金刚石(PCD),具有均匀致密的微观组织。

  • 优异的耐磨性

    凭借出色的耐磨性(Abrasion resistance),拉丝模寿命长,可实现稳定且持续的拉丝作业。

  • 高品质表面光洁度

    实现高品质的表面光洁度(Surface finish),适用于精密线材拉丝与精细精加工作业。

  • 多样的粒度 · 支撑结构

    可选择从 Sub-µm 到 50µm 的宽范围粒度,以及 Self-Supported · Tungsten Carbide-Supported 等支撑结构。

Suppliers

原石各供应商规格

SANDVIK HYPERION(G.E) 与 SUMITOMO 各自原石的尺寸及供货规格。选择供应商标签页即可查看详细规格表与 Shape 图纸。

Compax® - Dimensions & Availability Chart

Self-Supported Die Blanks

Compax Self-Supported Die Blanks — Dimensions & Availability
ADDMA Nominal Diamond
Diameter x Thickness
Grain size Product Dimension[mm]
Sub µm 5µm 25 µm Tool Blank
Diameter
Recommended
Bore Size(mm)
D63.1 x 1.05010-MFU5010-TSU5010-MF5010-TS5010-MFC5010-TSC0.5
D123.1 x 1.55015-MFU5015-TSU5015-MF5015-TS5015-MFC5015-TSC1.0
D155.2 x 2.55025-MF5025-TS5025-MFC5025-TSC1.5
D185.2 x 3.65035-MF5035-TS5035-MFC5035-TSC2.0

● = MF(metal filled)    ○ = TS(thermally stable)

Sub-micron die blanks belong to our Compax® die blanks family of products and one of many premium products available for the wire industry.

Sub-micron die blanks are polycrystalline (PCD) product with an ultra-fine grain microstructure.

The unique material properties provide very good abrasion resistance and the ability to achieve a high quality surface finish.

Tatget applications

  • brass-plated wire
  • electrical wire
  • fine finishing applications
  • glass scribing
  • sawing wire
  • stainless steel
  • tire cord
  • welding wire

Tungsten Carbide-Supported Die Blanks

Compax Tungsten Carbide-Supported Die Blanks — Dimensions & Availability
ADDMA Nominal Diamond
Diameter x Thickness
Grain size Product Dimension[mm]
3 µm 5 µm 12 µm 25 µm 50 µm Tool Blank
Diameter
Recommended
Bore Size(mm)
D121.5 x 1.552353.99±0.0130.8
D154.0 x 2.358235123522354308.12±0.0131.8
D184.0 x 2.958295129522954358.12±0.0132.3
D217.0 x 4.058405240553013.65±0.0133.5
D247.0 x 5.358535253553513.65±0.0134.6
13.0 x 7.05225572524.13±0.0255.2
D2713.0 x 8.751085208573024.13±0.0255.8
D3013.0 x 11.651115211573524.13±0.0257.6
18.6 x13.5591334.00±0.02511.6
D3318.6 x 15.5591534.00±0.02512.0
18.6 x 17.5591712.5
D3618.6 x 18.5591834.00±0.02512.7

* Maximum recommended bore size for non-ferrous wire. Hard-ferrous wire die size normaly should not exceed 65% of this diameter.

Zero/No-Support Dies material

SUMITOMO Zero/No-Support Dies material
ADDMA No. Product No. Dimensions(mm) Concentricity
(mm)
Maximum hole
size(mm)
Available grain size
dDT 1351225
* SELF-SUPPORTED DIE BLANKS
D6WD7052.5±0.1-1.0+0.2-0.0-0.5F-M(C)E
D12WD7103.2±0.1-1.5+0.2-0.0-1.0F-M(C)E
D15WD7155.2±0.1-2.5+0.2-0.0-1.5F-M(C)E
D18WD7205.2±0.1-3.5+0.2-0.0-2.0F-M(C)E
* SELF-SUPPORTED DIE BLANKS(THERMALLY STABLE)
D6WD8052.5±0.1-1.0+0.2-0.0-0.5F-M(C)E
D12WD8103.2±0.1-1.5+0.2-0.0-1.0F-M(C)E
D15WD8155.2±0.1-2.5+0.2-0.0-1.5F-M(C)E
D18WD8205.2±0.1-3.5+0.2-0.0-2.0F-M(C)E
* TUNGSTEN CARBIDE SUPPORTED DIE BLANKS
D12WD9101.5 +0.4-0.04.00+0.00-0.101.5+0.2-0.10.201.8FSM(C)E
D15WD9154.0±0.48.12±0.052.3+0.2-0.10.251.8FSM(C)E
D18WD9204.0±0.48.12±0.052.9+0.2-0.10.252.3FSM(C)E
D21WD9257.0 +0.8-0.113.35±0.054.0+0.2-0.10.353.5-SMCE
D24WD9307.0 +0.8-0.113.35±0.055.3+0.2-0.10.404.6-SMCE
D27WD9409.0 +0.8-0.314.50±0.057.5+0.2-0.10.405.4--MCE
WD94513.0+1.0-0.324.13±0.019.0+0.5-0.00.335.8--MCE
D30WD95013.0+1.0-0.324.13±0.0512.0+0.5-0.00.337.6--MCE
D33WD96013.0+1.0-0.324.13±0.0116.0+0.5-0.00.3310.5---CE
D36WD97019.0+1.0-0.035.00±0.0119.0+1.0-0.00.6012.7---E
WD97525.042.0020.00.6015.7---E
WD98030.0+2.0-0.047.13±0.0122.0+1.0-0.00.6019.0---E
WD99040.067.0025.00.7525.7---E
WD99545.067.0027.00.7529.0---E

Shape

  • 圆形俯视图与矩形剖面图

    WD910~950 / 970~995

  • 梯形剖面图

    WD960 / WD970

  • 梯形剖面图

    WD910 ~ 920MW

  • 矩形剖面图